Diameter of a hole after plating needs to be controlled

Diameter of a hole after plating needs to be controlled between 30^+0.050^-0.010 mm. If the plating thickness varies between 10-15 microns, diameter of the hole before plating should be

1. 30^+0.07^-0.030 mm
2. 30^+0.65^-0.020
3. 30^+0.08^-0.030 mm
4. 30^+0.70^-0.040

Remember flating comes from both side
So D_max – 2 × 0.01 = 30.05
D_max = 30.07mm
D_min – 2 × 0.015 = 30.01
D_min = 30.04