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Electrical Engineering materials
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Electrical engineering material miscellaneous
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Electrical engineering material miscellaneous
Easy Questions
Electrical Engineering materials
Electrical engineering material miscellaneous
Which of the following pair does not match?
Bond angle in diamond 109·5°
Conduction in copper wire Free electron
An example of hydrogen bond Hydrogen
Thermal expansion in metallic Ionic bond bond is greater than that in
Correct Option:
C
NA
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